Sign In | Join Free | My infospaceinc.com
China Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. logo
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Hefei Guofeng Advanced Basic Materials Technology Co., Ltd. A Leader in the Film Industry
Verified Supplier

1 Years

Home > Copper Clad Polyimide Film >

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications

  • 1
  • 2
  • 3

Brand Name : Guofeng

Model Number : 25um

Certification : SGS Reach ROHS

Place of Origin : China

MOQ : 150kg

Price : $300-$30000

Payment Terms : L/C,T/T

Supply Ability : Negotiation

Delivery Time : 7 Working Days

Packaging Details : Standard Packing

Cladding Material : Copper

Surface Treatment : Chemical Etching

Material : Polyimide

Adhesive Type : Acrylic

Contact Now

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications

Product Overview
The GL series represents a significant advance in polyimide film technology. Its patented production method yields a specially aligned molecular architecture, enhancing critical attributes—including tensile strength, dimensional stability, and chemical resistance—by a uniform 30%. This adaptable, naturally amber film is offered in tailored thicknesses and serves as the premier choice for high-performance applications such as adhesive carriers and sophisticated chip encapsulation.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year

Product Features

  • Outstanding mechanical strength and reliability

  • Superior dimensional stability under varying conditions

  • High-performance lamination and bonding capability

  • Full compliance with RoHS and REACH regulation



Product Applications

The GL series excels in demanding electronic manufacturing processes, where its enhanced properties are critical. It acts as the structural backbone in high-precision adhesive FCCL (Flexible Copper Clad Laminate) production. Its inherent stability also qualifies it as a premium choice for critical coverlay applications. Furthermore, it meets the stringent requirements of advanced semiconductor chip encapsulation and forms the durable core layer for high-performance specialty adhesive tapes.


Product Images:


Company Image:

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications


Product Tags:

copper-clad polyimide film laminate

      

flexible circuit copper laminate

      

high-precision polyimide film PCB

      
Quality Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications for sale

Copper-clad laminate utilizing polyimide film for high-precision flexible circuit applications Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)