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Payment Terms : L/C,T/T
Insulation : Excellent Insulation
Surface Finish : Smooth
Price : $300-$30000
Application : Electronic Devices
Model Number : 7.5um
Color : Transparent
MOQ : Negotiation
Delivery Time : Negotiation
Conductivity : Highly Conductive
Durability : Long-lasting
Flexibility : Highly Flexible
Supply Ability : Negotiation
Material : Flexible Printed Circuit Film
Packaging Details : Standard Packing
Certification : UL ISO ROHS
Place of Origin : China
Brand Name : Guofeng
Adhesion : Strong Adhesion
PI Base Film for FPCs and Semiconductor Packaging
Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide
It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs.
GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates.


To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
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PI Base Film for FPCs and Semiconductor Packaging Images |