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Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use

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Model Number : 7.5um

Thickness : 0.5mm

Payment Terms : L/C,T/T

Color : Yellow

Electrical Insulation : Highly Insulating

Price : $300-$30000

UV Resistance : Excellent

Supply Ability : Negotiation

Material : Polyimide

Surface Finish : Smooth

MOQ : Negotiation

Delivery Time : Negotiation

Shelf Life : 2 years

Place of Origin : China

Packaging Details : Standard Packing

Certification : UL ISO ROHS

Brand Name : Guofeng

Applications : Flexible Printed Circuits, Insulation, Aerospace Components

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Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use
High-performance polyimide film solutions tailored for electronic applications, superior insulation performance, and professional thermal control systems.
Product Specifications
Place of Origin ANHUI, CHINA
Certification UL ISO ROHS
Material Polyimide
Color Yellow
Treatment Single-side / Both Sides
Width 514MM 520MM 1028MM 1040MM
Thickness 5μm 7.5μm 11μm 12.5μm 25μm 50μm 70μm 75μm 100μm
Packing Style Standard Packing
Roll Length Customized
Packaging Details Wooden pallet
Supply Ability 2000 ton/year
Flexible Electronics Polyimide Film with Excellent Thermal and Electrical Properties
Product Overview
The GL-series high-performance polyimide film is a self-developed and produced biaxially stretched natural-colored PI film by our company. It comes in three different models, and is primarily applied to bonding base materials, IC packaging and other related fields.
Key Features

1.Excellent mechanical properties coupled with an extremely low thermal expansion rate
2.Superior surface bonding capability and strong adhesive performance.
3.Completely meets the requirements of RoHS and REACH environmental standards.

4.Authorized UL safety certification issued by the United States

Applications
GL-series high-performance polyimide film is primarily used for high-precision adhesive FCCL bases, high-stability coverlay films, chip encapsulation, and specialty tape substrates.
Factory Advantages
  • Factory Direct Pricing: Eliminate middlemen for cost savings, flexible order quantities, and prompt delivery
  • Professional Technical Support: Customized anti-fog testing and packaging performance improvement assistance
  • Customizable thicknesses, widths and surface treatments (matte, glossy, metallic)
  • Stable quality, efficient production, and competitive pricing for large-volume ord
Product Images

Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use

Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use

Handling & Storage Instructions
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions: Store in a cool, dry place away from direct sunlight. Avoid exposure to high humidity or extreme temperature fluctuations
Product Tags
Polyimide film

Product Tags:

Heat-resistant polyimide substrate

      

Flexible printed circuit insulation

      

Superior insulation PI film

      
Quality Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use for sale

Heat-Resistant Polyimide Substrate with Superior Insulation for Flexible Printed Circuit Use Images

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