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Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging

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Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging

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Model Number : 7.5um

Color : Transparent

Payment Terms : L/C,T/T

Insulation : Excellent Insulation

Surface Finish : Smooth

Price : $300-$30000

Application : Electronic Devices

Supply Ability : Negotiation

Material : Flexible Printed Circuit Film

Durability : Long-lasting

MOQ : Negotiation

Delivery Time : Negotiation

Conductivity : Highly Conductive

Packaging Details : Standard Packing

Flexibility : Highly Flexible

Place of Origin : China

Certification : UL ISO ROHS

Brand Name : Guofeng

Adhesion : Strong Adhesion

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Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging

Detail Information
Place of Origin:
ANHUI, CHINA
Certification:
UL ISO ROHS
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM 520MM 1028MM 1040MM
Thickness:
12.5μm 20μm 18μm 25μm
Packing Style:
Standard Packing
Application:

Roll Length:
Customized
Packaging Details:
Wooden pallet
Supply Ability:
2000 ton/year
Highlight:
High Thermally Conductive Polyimide Insulation Film for Power Devices
Product Description

Flexible Printed Circuit Base Film: High Dimensional Stability Polyimide

Product Overview
GL-series polyimide film features superior thermal resistance, premium electrical insulating performance and stable dimensional characteristics. Featuring an opaque matte black finish, the material is extensively applied in electronic components, flexible printed circuits and semiconductor packaging segments. It delivers reliable functional stability and exceptional light-shielding efficiency.


Product Features

It boasts superior mechanical performance, ultra-low CTE and great surface adhesiveness. The product meets RoHS & REACH standards and is safety-certified by US UL Labs.

Product Applications

GL high-spec polyimide film mainly serves high-precision adhesive FCCL base materials, dimensionally stable coverlays, chip packaging and specialty adhesive tape substrates.

Why Choose Our Factory?
Direct factory quotation service: Eliminate intermediate distributors to provide economical price points, flexible minimum order requirements and prompt cargo dispatch.
The company owns integrated technical strengths: customized anti-fog testing programs can be provided, together with professional technical counseling to improve packaging functional performance.
Thickness, width and surface textures (matte, gloss, metallic) of our polyimide substrates support personalized modification. Steady product quality, efficient manufacturing capacity and advantageous bulk prices are warranted. Customers may consult our team to obtain free test samples and exclusive bulk purchasing discounts.
Product pictures

Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging

Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging






Handling & Storage Instructions

To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:

  • Shelf Life: 6 months from the date of manufacture.
  • Storage Conditions:

    · Store in a cool, dry place away from direct sunlight will be necessary.

    · Avoid exposure to high humidity or extreme temperature fluctuations.

Tags: Polyimide film

Product Tags:

Flexible Polyimide Film substrates

      

Polyimide Base FPC manufacturing

      

Semiconductor encapsulation Polyimide Film

      
Quality Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging for sale

Polyimide Base Substrates for FPC Manufacturing and Semiconductor Encapsulation & Packaging Images

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